A band of wire removes molten solder away from a solder joining or a solder bridge or just for desoldering.

Fine pitch is more commonly referred to surface-mount components with a lead pitch of 25 mils or less.

Semiconductor devices, such as transistors and diodes that can change its basic characteristics in a powered electrical circuit, such as amplifiers and rectifiers.

An electrical circuit that provides a continuous quantitative output as a response from its input.

The width of the conductor pad surrounding a drilled hole.

Printed circuit design.

The ratio of the board thickness to the smallest-hole diameter of the printed circuit board.

A drawing describing the locations of components on a PCB.

Equipment that automatically tests and analyzes functional parameters to evaluate performance of the tested electronic devices.

A SMD package in which solder ball interconnects cover the bottom surface of the package.